http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101421672-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate | 2007-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56a0c2e233cad5624f7ffe3ea861bb41 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75430745914195fc2b9c74e9515e136b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dcf594f786cdfd7c7434c9f92deabb23 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_683db0cfd251c0a0ff0e5cbbbdea9126 |
| publicationDate | 2009-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-101421672-A |
| titleOfInvention | Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same |
| abstract | Disclosed is an alkaline development-type solder resist which is a composition developable with a dilute alkali solution and comprises the following components (A) to (D): (A) a photosensitive resin having a carboxyl group, which is produced by reacting a compound (a) having two or more cyclic ether groups or cyclic thioether groups in the molecule with an unsaturated monocarboxylic acid (b), reacting the resulting product with a polybasic acid anhydride (c) to produce a resin, reacting the resin with a compound (d) having both of a cyclic ether group and an ethylenically unsaturated group in the molecule, and reacting the resulting product with the polybasic acid anhydride (c) again; (B) an oxime ester-type photopolymerization initiator having an oxime ester group which is represented by the general formula (I); (C) a compound having two or more ethylenically unsaturated groups in the molecule; and (D) a thermocurable component. When the solder resist is formed into a dried coating film, the coating film has an absorbance of 0.3 to 1.2 at a wavelength of 350 to 375 nm per 25 [mu]m film thickness. (I) wherein R<1> represents a hydrogen atom, an alkyl group having 1 to 7 carbon atoms or a phenyl group; and R<2> represents an alkyl group having 1 to 7 carbon atoms or a phenyl group. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102443136-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106886128-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103869620-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102443136-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103109234-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8642234-B2 |
| priorityDate | 2006-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 194.