Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f75c33ae35e5d1dc4b05e62ec461c17f |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0392 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F11-00 |
filingDate |
2007-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d34ab94ade5682625946d915676a65b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f872eb367e023b262fd2787b9537eeaa |
publicationDate |
2009-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CN-101405363-A |
titleOfInvention |
Precoat composition for organic solderability preservative |
abstract |
The present invention provides an improved method of enhancing the solderability of a copper surface comprising the steps of contacting one or more copper surfaces with a pretreatment composition comprising a dilute solution of an aliphatic carboxylic acid and an additive selected from the group consisting of amines and ammonia and thereafter contacting the one or more surfaces with an organic solderability preservative composition. The improved organic solderability preservative process of the invention forms a more uniform coating that has a better appearance and color. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105772989-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105772989-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106929839-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106929839-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104046974-A |
priorityDate |
2006-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |