| abstract |
The present invention provides a laser perforation device that has a simple structure and with which pain to a person in skin perforation is reduced. In the device, a laser beam emitted from a laser emitting device (33) is branched into laser beam paths by splitters (170a, 170b, 170c) and mirrors (171a, 171b, 171c) and pierces skin (13) by applying the split beams to the same position (177) on the skin (13). Since the skin is pierced by a laser beam with a low output, pain to the person can be reduced. |