| abstract |
The invention provides a light-sensitive resin combination, which contains an adhesive resin (A), a diazo quinine compound (B) and a solvent (C). The light-sensitive resin combination is characterized in that the adhesive resin (A) contains at least one of a copolymer obtained by the reaction of a copolymer 3 obtained by copolymerizing the following (A1) to (A3) and (A4), or a copolymer 1 obtained by copolymerizing (A1), (A2) and (A4), and a copolymer 2 obtained by the reaction of the copolymer 1 and (A3) at the site of an epoxy group from the (A4) of the copolymer 1, further a copolymer obtained by the reaction of the copolymer 2 and (A5) and the hydroxylic site generated by the reaction of (A4) and (A3) of the copolymer 1. |