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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-521
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-28
filingDate 2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdea612a28a6256a15c12dbb18131a16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72338223f3d078b611add7d51db69910
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publicationDate 2008-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101302327-A
titleOfInvention Halogen-free fire-resistant epoxy resin composition, film and copper clad laminate
abstract The invention relates to an epoxy resin composition, which is characterized in that: phosphate esters which are provided with phenolic groups or benzoxazinyl are added into the epoxy resin composition to improve the flame resistance of the epoxy resin composition, and the molecular weight and the viscosity of the epoxy resin composition are higher than those of the prior phosphate esters. Because the phosphate esters can react with epoxy resins, the addition is higher than that of general flame retardant and the viscosity applied to a film of a copper foil substrate or a printed circuit board can be further improved.
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