| abstract |
The present invention provides a soldering inhibitor composition and condensate thereof, which has excellent developing performance, excellent resolving capability, excellent heat-resisting quantity and excellent resistance to plating needed by a pc board, a package substrate, a module base plate necessarily, and can provide a base plate with little curing shrinkage and no-warp.The soldering inhibitor composition is characterized in that: the solidified crosslink density computed by formula (1) being 2*10<SUP>3</SUP>-1.2*10<SUP>4</SUP>mol/m<SUP>3</SUP>, and glass transition temperature being more than 100 EDG C, n=E' min/3 PhiRT(1).In the formula, n being crosslink density, E' min being minimum value of the storage elastic modulus E', Phi being modified coefficient approximate 1, R being gas constant, T being absolute temperature of E' min. |