| abstract |
The invention relates to a nano-copper/copper alloy particle for surface modification, which is prepared by the following method that: water solution of copper salt or copper salt and alloy component salt with the concentration of 0.001 to 1 mol/L is prepared, then the water solution is fully mixed with the mixed solution of a reductant, a surface modifier and a weak polar or non-polar organic solvent, the still placement is carried out for 30 to 180min after the reaction for 30 to 180min under the alkaline environment with pH of 8 to 13, the organic phase is obtained by separation, and the nano-copper/copper alloy particle for surface modification is obtained after the concentration. The copper/copper alloy nanoparticle for surface modification which is provided by the invention has controllable particle size and distribution, difficult clustering, good antioxidant property, monodisperse property and good dispersion stability in the organic solvent. The preparation process and a device of the nano-copper/copper alloy particle for surface modification are simple, the raw materials are cheap and easy to obtain, the cost is low, and the yield is high, thus being applicable to the large-scale industrial production. |