| abstract |
The invention relates to a method for producing a soldering resistance film comprising following steps: coating photosensitive composition onto a substrate and drying it, irradiating a first laser and a second laser with different wavelength from the first laser onto the dried coated film, forming a pattern latent image obtained by irradiation of the first laser and the second laser, and developing by the basic aqueous solution. In addition, the photosensitive composition forming the soldering resistance film is provided as following: Each 25 mum thickness of the dried coated film before explosion, displays an absorbency of 0.6-1.2 in a wave length range of 355-380nm, and displays an absorbency of 0.3-0.6 at a wave length of 450 nm. |