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filingDate 2006-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cb3ce8b9d54feb558df8cd1107d7faf
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publicationDate 2008-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-101160219-A
titleOfInvention Transfer film containing a layer with wale structure
abstract The invention relates to a transfer film, in particular a hot embossing film, comprising a support film (18) and a transfer layer with a structured surface (14) that is applied to the support film (18) and can be detached from the latter (18). According to the invention, the support film (18) comprises a master relief structure (18m) on the side facing the structured layer (14) and the latter (14) comprises a relief structure (14o) that complements the master relief structure of the support film (18) on the side facing said film (18). The invention also relates to a method for producing the transfer film and to a multi-layered body (1) that is formed using said structured layer (14).
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