| abstract |
The present invention provides a photo curable and heat curable liquid solder mask composition and the printed circuit board of using the composition, the composition has the advantages of excellent coating film such as heat resisting property, closing property, electroless gold plating resisting property and electrical characteristic, etc. and excellent dry tack free property and operability, and the composition is alkali developable. The one liquid solder mask composition includes the following components: (A) a carboxylated photo sensitive resin which is gained by addition (c) compound that is provided with a cyclic ether group and an ethylenically unsaturated ester group in one molecule and the copolymer that is formed by (a) unsaturated carboxyl acid and (b) compound containing the ethylenically unsaturated group in one molecule besides the unsaturated carboxyl acid, besides the softening point is between 130 to 200 degree centigrade; (B) a diluent; (C) a photopolymerization evocating agent; (D) a cyanuramide or the organic acid salt; and (E) an inorganic filler. The invention also provides a printed circuit board using the solder mask composition. |