| abstract |
A adhesive sheet for semiconductor device manufacture is separably stuck on a lead frame or a wiring board, and consists of lamination having heat-resistant substrate and adhesive agent layer. The adhesive agent layer contains thermoplastic resin component (b) and removability application component (c). The invention aims to prevent paste residue and imperfect semiconductor device while maintaining superior wire bonding property and mold flushing property, when used in manufacture of a semiconductor device like QFN. |