http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100473262-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate | 2004-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da4c8fd550ce1980f2ff09ec117f8b8b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88c24331ec35b7ecea0cf624d19bc758 |
| publicationDate | 2009-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-100473262-C |
| titleOfInvention | Metal foil adhered laminate |
| abstract | The metal foil-clad laminate of the present invention comprises at least one polyimide layer made of a polyimide having repeating units represented by the following formula (I), at least one insulating substrate, and at least one metal foil layer. The polyimide is excellent in thermopress-bonding property, solubility in solvents and heat resistance, and exhibits a low dielectric constant. The metal foil-clad laminate having the polyimide layer is suitably applicable to high-frequency printed wiring boards, etc. |
| priorityDate | 2003-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 89.