| abstract |
The present invention provides a thermosetting resin composition which reduces hydrolyzing properties useful as a solder resist used in manufacturing printed-wiring boards and a marking ink, excels in heat resistance, chemical resistance, adhesion, electrical insulation properties and the like, is halogen-free, and has stabilized flame retardance, furthermore a thermosetting resin composition which excels in folding resistance suitably used in a semiconductor carrier tape and a solder resist for flexible printed-wiring boards and reduces warpage after curing, and its cured coating film. The thermosetting resin composition comprises (A) a carboxyl group-containing unsaturated polyester resin having one or more carboxyl groups and an ethylenically unsaturated group in one molecule, (B) a resin having two or more epoxy groups in one molecule, (C) an amine based active hydrogen compound, and (D) a phosphoric acid amide compound represented by formula (I). |