http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-100393832-C
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_29546c024a303f0c932a8dbeb3c88444 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2003-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8b1be0cb7d951683a711e3861bc91cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fdce5f5747c491a2dbe947f47ec9ba7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_28a90c5fd329cb6ab90ebd89303b7868 |
| publicationDate | 2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-100393832-C |
| titleOfInvention | Composition for polishing metal, polishing method for metal layer, and production method for wafer |
| abstract | A composition for polishing metal is used for polishing a metal layer and comprises a film forming compound that polymerizes on the surface of the metal layer, forming a polymer film on top of the metal layer. When the metal layer is polished, the metal layer is polished and planarized by the composition for polishing metal. A production method for wafers comprises a step in which the method of polishing the metal layer is used for polishing and planarizing the metal layer; which is formed on top of a wafer that contains recesses so as to fill and cover the recesses. According to the composition and the polishing method, because dishing is prevented, the planarity is improved; and the polishing rate for polishing metal layers, and particularly copper layers, is improved, enabling high speed polishing at low pressure. Furthermore, because scratching of the metal layer is also prevented, the yield is improved. |
| priorityDate | 2002-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 196.