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filingDate 2002-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_276dba7d6a474619920f279985c946cd
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publicationDate 2008-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-100393783-C
titleOfInvention Polyimide film excellent in alkali etching processability and punchability
abstract A polyimide film which satisfies at least either of the following requirements: (1) the dispersion of tear propagation resistance, C<sb>H</sb>, is 1.0 g or less; and (2) the coefficient of sliminess after immersion in an alkali solution, C<sb>R</sb>, is 20.0 or less. Since the polyimide film satisfies the requirement(s), it can have improved processability. The occurrence of processing failures can be effectively prevented even during etching or punching. Thus, the productivity in each step can be improved.
priorityDate 2001-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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