| abstract |
An anisotropic conductive film made of an adhesive resin composition in which conductive particles are dispersed. The adhesive resin composition is a thermosetting resin composition containing base resin composed of polyacetalized resin obtained by acetalizing polyvinyl alcohol and/or modified polyacetalized resin obtained by introducing an aliphatic unsaturated group in a side chain of the polyacetalized resin, melamine-series resin, (meth)acrylate phosphate, and alkyd resin. The present invention provides an anisotropic conductive film exhibiting high adhesive strength to both ITO and SiOx. |