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publicationDate 1984-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CH-645673-A5
titleOfInvention Process for vapour deposition of semiconductor layers on a substrate under vacuum, and device for carrying out the process
abstract The process comprises introducing a starting material into the evaporators (3) which have been heated to a temperature below the boiling point of the starting material. The substance is introduced periodically, by each of the evaporators (3) being charged in succession. The dose is selected in such a way that it is just sufficient to cover the working area of the evaporators (3) uniformly and is completely evaporated during time T before the next charge. The number of evaporators (3) is divisible by the number of main fractions in the starting material. Charging is carried out at an interval equal to T DIVIDED n during a period which is smaller than said interval by a factor of 10 to 15. The material is vapour-deposited simultaneously from all the charged evaporators (3) in such a way that the molecular streams overlap in the condensation zone. The process proposed can be applied for generating homogeneous semiconductor layers having great lengths and large areas on a flexible substrate, and of layers having predefined compositions of fractionating materials. <IMAGE>
priorityDate 1979-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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