http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CH-525923-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_42f27437cc239fa0cb21abbbe22f09a9 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-423 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 |
filingDate | 1966-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0194f67ab05a53f1b81933a483b97758 |
publicationDate | 1972-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CH-525923-A |
titleOfInvention | Powder curable epoxy resin composition |
abstract | Powdered epoxy resin consists of an intimate mixture of a normally solid eposy resin and tetrachlorophthalic anhydride as curing agent, the ratio of curing-agent to resin being 0.5-1.25 anhydride equivalents per 1.0 epoxy equivalent of the resin. Pref., the composition also contains fillers and modifiers in amounts of 0-80% wt., and pigments in amounts of 0-5% wt. The resin component may be (a) a bisphenol type with a mol. wt. of 400-5000, and a softening point of 20-135 deg.C.; (b) an epoxy-novolak resin with a mol. wt. of 500-1500, and a softening point of 30-120 deg.C; or (c) a cyclohexene oxide type with a mol. wt. of more than 275 and a functionality of 2. The resin may also contain 0.10-1.5% wt. of a catalyst, pref. a metal stearate. The epoxy resin composition obtained is characterised by good storage-stability at room temp., and good reactivity at the curing temp. |
priorityDate | 1966-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.