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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-20
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10
filingDate 1968-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68b365a2ba228c083d8563eb1cd2ca1e
publicationDate 1971-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CH-508683-A
titleOfInvention Phenoplast molding compounds with improved properties, especially for transfer molding
abstract Phenolic moulding materials with improved plasticity contain 0.1-30% wt. formamide (I) HCON(R1)(R2), where R1 and R2 = H atoms, or aliphatic, cycloaliphatic or heterocyclic groups; or the group -N(R1)(R2) forms part of a heterocyclic ring. Addition of formamides (I), e.g. formamide, N-hydroxyethylformamide or dimethylformamide, gives phenolic resin moulding materials of improved flow properties and lowered minimum moulding pressure. The mixts. are esp. useful for injection mouldings. 2% wt. formamide was sprayed onto a sawdust-contg. phenolic resin mass in granulate form of the type 31/16 (DIN 7768). The mixt. was formed into a 10 mm plate by moulding for 60 secs. at 35 atm. and 165 deg.C.
priorityDate 1967-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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