| abstract |
The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber sealed from the surroundings, by heating and melting solder material (16) which is arranged between the components to be joined (12A, 12B). The components to be joined (12A, 12B) are temporarily joined by an adhesive material (18) to form a solder group (10) in which the components (12A, 12B) are held in place relative to each other in a joining position. |