| abstract |
A gypsum board composition was disclosed which comprises stucco, adhesive, water and additive for improving bonding, wherein the additive for improving bonding is shown in chemical formula as M ?M ?(OH) 2(A n-)·mH 2O,wherein M ? is a divalent metal ion, M ? is a trivalent metal ion, and A n- is an interlayer anion, and wherein M ?and M ? are different metals. Also, a gypsum board made with the composition of the above and a method for using a compound shown in the aforesaid chemical formula were disclosed. |