| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_04f1cd2075bda059f0273c1161941e3c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0665 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2013-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd33775e890bbe6dcf453d94edbc9e62 |
| publicationDate |
2014-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2873883-A1 |
| titleOfInvention |
Three-dimensional electronic packages utilizing unpatterned adhesive layer |
| abstract |
An electronic package may be fabricated by forming a first layer of insulating material on a first substrate such that the first layer covers a contact pad; forming an opening through the first layer to expose the contact pad; forming an un-patterned second layer on the first layer, the second layer including an adhesive having a viscosity less than that of the first layer, wherein a region of the second layer obstructs the contact pad; removing the region to re-expose the contact pad; aligning a second substrate with the first substrate such that a via of the second substrate is aligned with the opening; bonding the first substrate and the second substrate together at the second layer; and forming an interconnect in contact with the contact pad by depositing a conductive material through the via and the opening. |
| priorityDate |
2012-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |