http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2836015-C

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filingDate 2012-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d08c2e5fb6915c1be15d27a762f0ae55
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publicationDate 2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2836015-C
titleOfInvention Resin transfer molding method and resin transfer molding apparatus
abstract Provided is a method for molding a molded article without voids, porosity, and resin sinks on the surface or inside while maintaining a plate thickness accuracy even for a thick plate member having a plate thickness of 10 mm or more. A RTM method comprising a first temperature raising step comprising impregnating a thermosetting resin in a dry fiber preform disposed in a molding die comprising two or more separate die members, and thereafter raising temperature of any of the die members constituting the molding die to form a temperature gradient having a temperature difference of a predetermined value or more from one side of the dry fiber preform toward the other side; and a second temperature raising step of raising temperature of a die member different from the die member whose temperature is raised in the first temperature raising step.
priorityDate 2011-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.