| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8716383b4f0d2a9e39a696fccaa7e3c4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-0689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0819
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0645 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-1284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-5085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01L3-00 |
| filingDate |
2011-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97ac5a569dcdd3e66892f8a659e9e4c4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5017f545ebe0ff256f852f5e8115f872 |
| publicationDate |
2012-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2804564-A1 |
| titleOfInvention |
A chip assembly for use in a microfluidic analysis system |
| abstract |
A chip assembly (100) for use in a microfluidic analysis system, such as a patch clamp apparatus, comprises a chip (102) having an outer wall (105), a carrier structure (104) comprising an aperture (110) for receiving the chip (102), the aperture (110) defining an inner wall (107), wherein the chip (102) is arranged in the aperture (110) with a liquid tight seal (106) between the outer wall (105) of the chip (102) and the inner wall (107) of the aperture (110). The chip (102) may be sealed and bonded to the carrier structure by means of a bonding material (106), such as an UV curing adhesive. A through hole (108) in the chip (102) is aligned with the aperture (110) in the carrier structure (104). A method for manufacturing the chip assembly (100) is further disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109097264-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109097264-A |
| priorityDate |
2010-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |