| abstract |
The present invention relates to a copper containing Levyne molecular sieve having a silica to alumina mole ratio less than 30 and a Cu:Al atomic ratio less than 0.45, wherein the Levyne molecular sieve retains at least 60 % of its surface area after exposure to a temperature of from about 750°C to about 950°C in the present of up to 10 volume percent water vapor for a time ranging from about 1 to about 48 hours. |