| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3ac71be3a78b5d78fae53eee396bf240 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R43-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R9-03 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-405 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate |
2011-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8f7563959e845190be8d8a06c9bb528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb4c8db45b0f53e21192ae638dde433b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d35965de0e489dbc4047f405ffb52ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1198ae6f59580463a628266bcb1e6a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfcb29d4aeacfada908f9d8ce60c6798
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43dc34d968e13e0b5b09827a537bc0a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_208e25a697c0bf1394254d341610cee3 |
| publicationDate |
2011-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2728300-A1 |
| titleOfInvention |
System and method for polyurethane bonding during and after overmolding |
| abstract |
An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3859922-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11404856-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103117139-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103117139-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3859917-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3859916-A1 |
| priorityDate |
2010-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |