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filingDate 2008-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55eb757f2c2e8e6c44a9a91f56a10d9d
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publicationDate 2014-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2711649-C
titleOfInvention Circuit board having an electrodeposited coating on a conductive core within a via and method of making same
abstract A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
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