| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0aa485d286850898ac84bdb906bc1a41 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
2006-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c1e3c5848f7219caeab79a012491da2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4120e45292eed777fad2ca561210abc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10a445140eb7ebcdc6c693f34c166d12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_349e6afc7bfbf30375709c6546b7e579 |
| publicationDate |
2007-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2622918-A1 |
| titleOfInvention |
Electroplating method for coating a substrate surface with a metal |
| abstract |
The present invention relates to a coating process by electroplating a surface of a substrate by copper. According to the invention, this method comprises: a step during which said surface to be coated is brought into contact without electric polarization with an electroplating bath; a step of formation of the coating during which said surface is polarized; a step in which said surface is separated from the electrodeposition bath under electric polarization; the aforementioned electrodeposition bath comprising in solution in a solvent: a source of copper ions, in a concentration of 0.4 to 40 mM; at least one copper complexing agent. |
| priorityDate |
2005-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |