| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_74973199515dbabd2310245aab03e282 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2105-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-0272
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2077-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2709-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2707-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate |
2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dff70ea0d1519f4a32941303fb717ac7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_476463a8e8329b95abaaae074f34ec10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0124ecff641d89abb8d795773c0d4e97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a96fc9de85fff54ef598a36cb7b55bd |
| publicationDate |
2010-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2616792-C |
| titleOfInvention |
Rtm molding method |
| abstract |
A resin transfer molding (RTM) process by which FRP moldings having enhanced fiber volume contents (Vf) and improved strength and lightness can be obtained. An RTM process which comprises using a chain curing resin composition, adjusting the maximum temperature of the head of the resin composition under chain curing within 10 seconds after the cure initiation to a temperature higher than the temperature of the resin composition after impregnation but before curing by 50~C or above, and conducting the chain curing of the resin composition at a Vf of 41% or above. |
| priorityDate |
2005-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |