| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e43b4ca6b41ce9f54c9a895d474c81a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31725 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-46 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
| filingDate |
2006-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_923ad5c7f2d053b2cf8fc9219994dc90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdbe68b4b8b235b7af0eba6b9f7d556f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a479df447078dfded966a57545d7eee |
| publicationDate |
2007-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2614648-A1 |
| titleOfInvention |
Polyamide resin, epoxy resin compositions, and cured articles thereof |
| abstract |
An aromatic polyamide resin having phenolic hydroxyl groups as represented by the general formula (1): (1) [wherein m and n in terms of averages satisfy the relationship: 0.005 < n/(m+n) < 0.05 and the sum of m and n is a positive number of 2 to 200; Ar1 is a divalent aromatic group; Ar2 is a divalent aromatic group having a phenolic hydroxyl group; and Ar3 is a divalent aromatic group]; and resin compositions (such as epoxy resin compositions) containing the polyamide resin. The polyamide resin little contains ionic impurities and is improved in adhesiveness without adversely affecting the excellent characteristics inherent in conventional aromatic polyamide resins having phenolic hydroxyl groups, e.g., the excellent flexibility, electrical characteristics, and flame retardance of cured articles of epoxy resin compositions containing the polyamide resins. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8304508-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8003749-B2 |
| priorityDate |
2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |