http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2541201-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a34d7d2e0d09a58cb7bf4a04c81162e |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate | 2004-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_575bc21aa639fb449842f5f033cddaef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f37371c2d7d07bfd8958c30905394c1 |
| publicationDate | 2005-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CA-2541201-A1 |
| titleOfInvention | Methods and systems for providing mems devices with a top cap and upper sense plate |
| abstract | A method for fabricating a MEMS device (300) having a top cap (250) and an upper sense plate is described. The method includes producing (152) a device wafer (230) including an etched substrate (186), etched MEMS device components, and interconnect metal (198, 200), a portion of the interconnect metal being bond pads (132) and adding (154) a metal wraparound layer (232) to a back side (330), edges (320), and a portion of a front side (342) of the device wafer. The method also includes producing (156) an upper wafer including an etched substrate and interconnect metal, bonding (160) the device wafer and the upper wafer, and dicing (164) the bonded upper wafer and device wafer into individual MEMS devices. |
| priorityDate | 2003-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.