| abstract |
A method and apparatus for providing cryogenic cooling to HTS devices (24), in particular those that are used in high-voltage electric power applications. The method involves pressurizing liquid cryogen (46, 48) to above one atmospheric pressure to improve its dielectric strength, while sub-cooling the liquid cryogen to below its saturation temperature in order to improve the performance of the HTS components (24) of the device. An apparatus (10) utilizing such a cooling method consists of a vessel that contains a pressurized gaseous cryogen region (44) and a sub-cooled liquid cryogen bath, a liquid cryogen heating (52) coupled with a gaseous cryogen venting scheme (30) to maintain the pressure of the cryogen to a value in a range that corresponds to optimum dielectric strength of the liquid cryogen, and a cooling system that maintains the liquid cryogen (46, 48) at a temperature below its boiling point to improve the performance of HTS materials (24) used in the device (10). |