| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e4589b30807b53be5b8d5c09bfad19dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ae7e6a920f1ac925043aeef84381c23 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-0056 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 |
| filingDate |
2002-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_308b35a7529658193623a51b8ef838af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7bebf7757cde537eec1bbb04acb6bff1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad73f575ad5162eb81ee4047af6f3c75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02acba5db9316876b8db20842c95350f |
| publicationDate |
2011-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2467806-C |
| titleOfInvention |
Method for polishing a substrate surface |
| abstract |
According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AIN substrate surfaces. |
| priorityDate |
2001-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |