| abstract |
A process for manufacturing integrated circuits in flip-chip technology having contact elements (31) realised on predetermined contact areas (23), comprises the steps of readying electrical connections (30) in such a way as mutually to connect all the contact areas (23) of said integrated circuit (21), galvanically depositing a contact element (31) in correspondence with each of said contact areas (23) and interrupting said electrical connections (30) between the contact areas (23). |