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filingDate 2002-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca56a5fff7daa810adabee9731e4805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e80a4c5c18b1095da703821670250be
publicationDate 2002-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2426648-A1
titleOfInvention Plating method of metal film on the surface of polymer
abstract The present invention relates to a method for plating the surface of polymer materials with a metal film by treating the surface of polymer materials with cold plasma method to introduce hydrophilic fuctional groups and then plating the surface of polymer materials with a metal film according to the electroless plating method. Wherein said method is characterized in that the cold plasma treatment reduces the contact angle of the surface of polymer materials to water by 5 to 60~. Further, in said method the surface of polymer materials can be more efficiently plated with the metal film by aditionally practicing the step either of immersing the polymer material into an organic solvent for 0.1 to 5 minutes or of washing the polymer material with ultrasonic washing machine, after introducing the hydrophilic functional groups by treatment of cold plasma. The plating method according to the present invention is very stable and readily applicable and can endow new properties, which are not possessed by the polymer material itself, including improvement of appearance quality, improvement of mechanical properties, improvement of heat resistance and durability, decrease of absoptivity, rendering the conductivity of heat and electric current, soldering ability and electromagnetic wave shielding effect, etc., to the polymer material. The polymer materials plated by the plating method according to the present invention improves their performance and therefore, can be used in various industrial fields for shielding electromagnetic wave generated from the information processing equipments, preparing the printed circuit board, preparing various forms of the electrodes and antistatic boards, and the like.
priorityDate 2001-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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