| abstract |
The present invention provides a cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape which has a peeling strength not too high and not too low and small in difference between the maximum value and the minimum value and which has high transparency. Specifically, the present invention provides a cover tape for packaging electronic components, which can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein and which comprises (A) a biaxially oriented film layer made of a polyester, a polypropylene or a nylon and (B) a thermoplastic resin layer composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of a polystyrene, laminated to one side of the layer A. |