abstract |
A resin composition which comprises (A) a saponified ethylene/vinyl acetate copolymer, (B) a polyamide resin having a melting point of 160~C or lower, and (C) a small amount of a boron compound; and a layered product comprising a multilayered molding composed of (X) a layer of the resin composition and (Y) a layer of a thermoplastic resin. |