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filingDate 1996-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8c902f4c9391d6181076aed25bbdb10
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publicationDate 2005-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2233329-C
titleOfInvention Method for electrolytic deposition of metal coatings
abstract The invention relates to a process for the electrolytic deposition of metal layers, in particular copper layers, of specific physico-mechanical and optical characteristics and of even thickness. With known processes using dissolving anodes and direct current, only an uneven metal layer distribution can be achieved on articles of complex shape. The problem of uneven layer thickness at different points on article surfaces can be alleviated by using a pulsed current or pulsed voltage process, but this does not solve the other problem of continually changing geometry during deposition as the anodes dissolve. This problem can be eliminated by using non-dissolving anodes. To ensure adequate anode stability and a high lustre of the layers even at points on the workpiece surface where the metal is deposited with high current density, compounds of an electrochemically reversible redox system must be added to the deposition solution.
priorityDate 1995-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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