http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2228168-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67034
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
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filingDate 1996-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10a48b94c412f5233584359360d54375
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5446f9cf520677289ec0f534d0950c05
publicationDate 1997-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2228168-A1
titleOfInvention Procedure for drying silicon
abstract The invention relates to a procedure applicable for drying substrate surfaces of a large number of materials, such as semiconductors, metals, plastics and, in particular, silicon. The silicon (1) is dipped into a liquid bath (2) and the silicon (1) is separated from the liquid (3), the liquid of the bath (2) consisting of an aqueous HF solution (3) with a concentration between .001 and 50 %. By adding a gas mixture containing O2/O3 immediately after the drying process is finished, the silicon surface is hydrophilized. By adding a gas mixture containing O2/O3 during the drying process, cleaning takes place as the ozone enters the solution on the liquid surface.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2486287-C2
priorityDate 1995-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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