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filingDate 1996-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_308613d663630fd1bfd0fc323539507a
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publicationDate 2005-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2220359-C
titleOfInvention Heat cured foundry binder systems and their uses
abstract A heat cured foundry binder system free of nitrogen and formaldehyde which prevents casting defects is useful in the fabrication of a mold for metal casting and comprises a furan resin and a curing catalyst composition containing water, copper aryl sulfonate, aryl sulfonic acid and a copper halide; optionally with polyvinyl alcohol, furfuryl alcoho l, polyvinyl acetate and resorcinol pitch and/or bisphenol A tar.
priorityDate 1995-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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