http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2198422-A1

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filingDate 1997-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d0cfc681acd3d319085b843c248b1fb
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publicationDate 1997-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2198422-A1
titleOfInvention Enhanced boron nitride composition and polymer based high thermal conductivity molding compound
abstract The present invention relates to a boron nitride composition of particles of boron nitride and a nonionic surfactant for use as a filler with a distribution of agglomerates having an average particle size in the range of between 20-80 microns and to a molding compound having a high thermal conductivity of above at least 5 W/m°K. The molding compound comprises a polymer base material, a filler and a nonionic surfactant with the filler comprising boron nitride in a concentration of at least 60% by weight of said composition and wherein the nonionic surfactant is selected from the class consisting of carboxylic acid amides and carboxylic acid esters.
priorityDate 1996-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.