| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de92cc53024e8ec4f3178b2fd302c983 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N1-247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41M1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41C1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 |
| filingDate |
1996-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4036db32970938c7322a5ad3c96f13c2 |
| publicationDate |
1998-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2181207-A1 |
| titleOfInvention |
Polymeric stencil for use in electronic assemblies and method of making same |
| abstract |
A method of manufacturing a polymeric stencil, and in particular a polyimide stencil, for use in solder paste printing of electronic circuit boards involves assembling the polymeric stencil to a frame structure of metallic material such as aluminum. The polymeric stencil is secured tautly across the frame structure. The polymeric stencil typically has a thickness in the range of 0.005 to 0.012 inches and lends itself to being readily cut by low power lasers. The preferred method of cutting land patterns from the stencil utilizes a CO2 laser. The process lends itself to pre-fabrication of the frame and stencil prior to cutting to reduce the turn around time to produce a stencil once an order is taken. The polymeric stencil can be readily cleaned with a mild detergent after laser cutting. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013068822-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016126870-A1 |
| priorityDate |
1996-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |