http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CA-2175909-C
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e4f9f1c98bdcbac68d647ab199bbbede |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00 |
filingDate | 1994-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2006-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e26572489a779f4607d7b2ec8745c30 |
publicationDate | 2006-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CA-2175909-C |
titleOfInvention | Ammonia-free deposition of copper by disproportionation |
abstract | An ammonia-free reducer is added to cupric ions to achieve reduction to cupr ous hydroxide in a process for the deposition of metalli c copper on a catalytically activated surface by rapidly reducing cupric ions in aqueous solution to cuprous hydroxide, without substa ntial reduction to elemental or metallic copper, and thereafter effecting controll ed disproportionation of the resultant cuprous hydroxide to bring about the deposition of metallic copper. The ammonia-free reducer is prefera bly hydroxylamine or its salts in the presence of a wate r soluble alkali metal - or alkaline earth metal - hydroxide, more preferably sodium hydroxide. |
priorityDate | 1993-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 109.