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filingDate 1995-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2161462-A1
titleOfInvention Solvent-less vapor deposition apparatus and process for application of soldering fluxes
abstract Apparatus and method for condensing a solderless flux vapor onto a work surface to be soldered, such as an electronic circuit board. The flux vapor is created by heating flux in a liquid state to a temperature greater than the temperature of the work surface. Flux is applied to the work surface without the use of any volatile organic chemicals.
priorityDate 1994-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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