| abstract |
Highly filled, curable compositions containing a curable liquid, e.g. methyl methacrylate; 20 to 80 % by weight of a finely divided inorganic filler of defined particle size, e.g. silica; a non-functionalised polymer containing a low Tg component which is soluble in the curable liquid, e.g. a non-functionalised vinyl aromatic/conjugated diene block copolymer; and other components which disperse the filler in the curable liquid and couple the filler to the matrix can be used to produce cured composites which show improved resistance to stress induced by thermal cycling. |