| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03c74eaf9554d930a41dc233324eee29 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249997
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2984 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J13-125 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01J13-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J121-00 |
| filingDate |
1993-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04525f171b60f1de8210709f179c40aa |
| publicationDate |
1994-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2112012-A1 |
| titleOfInvention |
Method for producing microencapsulated adhesive and adhesive composition resulting therefrom |
| abstract |
ABSTRACT OF THE DISCLOSURE A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition or an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/ formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes. |
| priorityDate |
1992-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |