Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0efa077d881a96aeb1e29b21ef1bbb58 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-404 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-02 |
filingDate |
1992-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1996-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_681d83f0f34695cb12f4835d4a039f0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2283bfad4579dbc7a407869e58cb0cf3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f22a51c40689849425e6a9282252c141 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a7e25a87c4dc13d61db287e82cbe2ff |
publicationDate |
1996-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
CA-2067442-C |
titleOfInvention |
Heat-curable bismaleimide molding compositions |
abstract |
Heat-curable bismaleimide resins contain a bismaleimide, an aromatic dialkenyl compound as comonomer and also from 1 to 40% by weight of a monoalkenyl compound, preferably 2-hydroxy-3-allyl biphenyl, as reactive diluent. |
priorityDate |
1991-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |