| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09781
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-1084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10969
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10818
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10659
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10522 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-341 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
1991-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1993-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_550e37c07842cf03b0fd3459f1ca7fea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9cf9d66b2aec80bc44bd300e50328492 |
| publicationDate |
1993-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2033699-C |
| titleOfInvention |
Electronic part with heat radiating member |
| abstract |
ABSTRACT OF THE DISCLOSURE The structure of an electronic part which may be mounted on and soldered to the surface of a printed circuit board, and a method of mounting such an electronic part. While the electronic part mounted on the circuit board is in operation, heat generated by the part is efficiently radiated to the surroundings. Connecting terminals extending out from the electronic part are firmly soldered to the circuit board by a minimum of heat, whereby the bonding strength and the strength against shocks are enhanced. The electronic part of interest and other electronic parts near it are free from damage ascribable to heat when the former has connecting terminals thereof soldered to the circuit board. When the connecting terminals of the electronic part are soldered to the circuit board by a laser beam, other electronic parts mounted on the circuit board are prevented from being damaged by the laser beam. |
| priorityDate |
1990-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |