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filingDate 1990-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_023defb0311c971051f3f8f2e76d9346
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publicationDate 1991-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CA-2031636-A1
titleOfInvention Method of producing cmos transistor
abstract ABSTRACT OF THE DISCLOSURE The method of producing a CMOS transistor device. A pair of device regions are formed and separated relation from each other by a field oxide film on a pair of corresponding well regions formed in a semiconductor substrate. A gate insulating film and a gate electrode are sequentially formed on each of the device regions. The gate insulating film is removed through a mask of the patterned gate electrode to expose a silicon active surface at least in one of the device regions. A diborane gas containing P type boron impurity is applied to the silicon active surface to form thereon a boron adsorption film. N type arsenic impurity is doped into the other device region by ion implantation to form N type source and drain regions while masking the one device region. The boron is diffused from the adsorption film into the one device region to form P type source and drain regions by annealing of the substrate.
priorityDate 1989-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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