| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5d35cbcd18261ca6afc76a9f64ae2a1 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0537
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20 |
| filingDate |
1990-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7055912d0a58ced177fad1b68b99409f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1fca3d5f62fbd1a896bf4a6c8c594b4 |
| publicationDate |
1990-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CA-2031489-A1 |
| titleOfInvention |
Adhesion promotor for thermoplastic substrates |
| abstract |
This invention relates to an adhesion promoting composition and method for its use for promoting adhesion of printed circuits on thermoplastic substrates. The composition includes isopropanol with either methylene chloride or resorcinol. An added ingredient includes polycyclohexanone. The preferred substrate is polyarylsulfone. |
| priorityDate |
1989-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |